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Proceedings Paper

Moire interferometry applied to ferroelectric ceramics
Author(s): Zhong Wei Liu; D. N. Fang; Huimin Xie; Q. D. Bing; S. Li; Fulong Dai
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Paper Abstract

This paper introduces how to in situ observe fracture behavior aroung a crack tip in ferroelectric ceramics under combined electromechancial loading by use of a moire interferometry technique. The deformation field induced by electric field and stress concentration near the crack tip in three-points bending experiments was measured. By analyzing the moire interferometry images it is found that under a constant mechanical load, an electical field has no effect on crack extension in the case that the directions of the poling, electric field and crack extension are perpendicular to each other. When the poling direction is parallel to the crack extension direction and perpendicular to the electric field, strain decreases faster than values predicted by the theoretical analysis as the distance away from the crack tip increases. In addition, as the electric field raises the strain near the crack tip increase, and the strain concentration phenomena becomes more significant.

Paper Details

Date Published: 29 April 2003
PDF: 9 pages
Proc. SPIE 5058, Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002, (29 April 2003); doi: 10.1117/12.509794
Show Author Affiliations
Zhong Wei Liu, Tsinghua Univ. (China)
D. N. Fang, Tsinghua Univ. (China)
Huimin Xie, Tsinghua Univ. (China)
Q. D. Bing, Tsinghua Univ. (China)
S. Li, Tsinghua Univ. (China)
Fulong Dai, Tsinghua Univ. (China)

Published in SPIE Proceedings Vol. 5058:
Optical Technology and Image Processing for Fluids and Solids Diagnostics 2002
Gong Xin Shen; Soyoung S. Cha; Fu-Pen Chiang; Carolyn R. Mercer, Editor(s)

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