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Proceedings Paper

Simulation of bulk micromachined vibration sensor with low noise
Author(s): Xiaowei Liu; Mingxue Huo; Weiping Chen; Qiang Chen
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Paper Abstract

In this paper a novel capacitive micro-vibration sensor with multi-folding beams, fabricated by bulk micromachining, is presented. The microstructures of the vibration sensor are simulated by the finite element method (FEM). The relations between the structural parameters and the sensitivity and frequency response of the sensor were considered in the simulation. The static and modal analyzing results of the sensors show that the higher sensitivity and mechanical strength with multi-folding beam structure were achieved. The microstructure with beam thickness under 400um can be fabricated with DRIE technology. When the area of silicon proof mass is 2.5×105 μm2, and the thickness of the proof mass vary from 40 μm to 80 μm, the mechanical noise is about 9×10-6g/√Hz. The sensor with resonant frequency up to 5kHz can be used to measure the vibration signal in a wider frequency range.

Paper Details

Date Published: 24 April 2003
PDF: 6 pages
Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.498848
Show Author Affiliations
Xiaowei Liu, Harbin Institute of Technology (China)
Mingxue Huo, Harbin Institute of Technology (China)
Weiping Chen, Harbin Institute of Technology (China)
Qiang Chen, Harbin Institute of Technology (China)

Published in SPIE Proceedings Vol. 5116:
Smart Sensors, Actuators, and MEMS
Jung-Chih Chiao; Vijay K. Varadan; Carles Cané, Editor(s)

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