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Proceedings Paper

Tight integration of imaging, motion, and data acquisition techniques for fiber optic alignment in single and arrayed photonics devices
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Paper Abstract

Packaging and testing represent a good fraction of the cost of the current photonics devices. Packaging includes the complex transition from the input/output fibers to the device itself, which requires very accurate alignment, bonding, tracking while the curing process takes place, and verification of the complete assembly characteristics. Industry needs to lower the cost/increase the production rates of these devices and the answer to these needs is to automate assembly and testing. The most efficient way of achieving this is by tightly integrating image processing and analysis techniques with nanopositioning motion systems and data acquisition. The paper will provide details, results and performances of alignment systems based on these techniques.

Paper Details

Date Published: 8 July 2003
PDF: 8 pages
Proc. SPIE 5036, Photonics, Devices, and Systems II, (8 July 2003); doi: 10.1117/12.498345
Show Author Affiliations
Ignazio E. M. Piacentini, National Instruments (Italy)

Published in SPIE Proceedings Vol. 5036:
Photonics, Devices, and Systems II
Miroslav Hrabovsky; Dagmar Senderakova; Pavel Tomanek, Editor(s)

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