Share Email Print
cover

Proceedings Paper

1024 x 1024 large-format resistive array (LFRA) design, fabrication, and system development status
Author(s): Paul Tristan Bryant; Jim Oleson; Brian Lindberg; Kevin Sparkman; Stephen W. McHugh; Steve L. Solomon
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Resistive emitter-based IRSP technology still leads the industry in terms of a flickerless, high dynamic range test solution. Santa Barbara Infrared (SBIR) is producing a high performance 1024 x 1024 Large Format Resistive emitter Array (LFRA) for use in the next generation of IR Scene Projectors (IRSPs). The CMOS Read-In Integrated Circuit (RIIC) was designed by SBIR and Indigo Systems, and fabricated at AMI Semiconductor. Performance and features include > 700 K MWIR maximum apparent temperature, 5 ms radiance rise time (10-90%), 200 Hz full frame update, and 400 Hz window mode operation. Ten 8” CMOS wafers have been fabricated and preliminarily characterized. Emitter pixel design is underway and emitter fabrication is scheduled to start at Microelectronics Center of North Carolina Research & Development Institute (MCNC-RDI) in mid-2003. This paper discusses the RIIC design, wafer probe test results, emitter pixel design, emitter fabrication plans, packaging and test plans, and reports on 1024 x 1024 IRSP system component development status.

Paper Details

Date Published: 12 September 2003
PDF: 9 pages
Proc. SPIE 5092, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII, (12 September 2003); doi: 10.1117/12.498066
Show Author Affiliations
Paul Tristan Bryant, Santa Barbara Infrared, Inc. (United States)
Jim Oleson, Santa Barbara Infrared, Inc. (United States)
Brian Lindberg, Santa Barbara Infrared, Inc. (United States)
Kevin Sparkman, Santa Barbara Infrared, Inc. (United States)
Stephen W. McHugh, Santa Barbara Infrared, Inc. (United States)
Steve L. Solomon, Acumen Consulting (United States)


Published in SPIE Proceedings Vol. 5092:
Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII
Robert Lee Murrer Jr., Editor(s)

© SPIE. Terms of Use
Back to Top