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Proceedings Paper

Employing Step and Flash imprint lithography for gate-level patterning of a MOSFET device
Author(s): Britain J. Smith; Nicholas A. Stacey; J. P. Donnelly; David M. Onsongo; Todd C. Bailey; Chris J. Mackay; Douglas J. Resnick; William J. Dauksher; David P. Mancini; Kevin J. Nordquist; S. V. Sreenivasan; Sanjay K. Banerjee; John G. Ekerdt; Grant C. Willson
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Paper Abstract

Step and Flash Imprint Lithography (SFIL) is an alternative lithography technique that enables patterning of sub-100 nm features at a cost that has the potential to be substantially lower than either conventional projection lithography or proposed next generation lithography techniques. SFIL is a molding process that transfers the topography of a rigid transparent template using a low-viscosity, UV-curable organosilicon solution at room temperature and with minimal applied pressure. Employing SFIL technology we have successfully patterned areas of high and low density, semi-dense and isolated lines down to 20 nm, and demonstrated the capability of layer-to-layer alignment. We have also confirmed the use of SFIL to produce functional optical devices including a micropolarizer array consisting of orthogonal 100 nm titanium lines and spaces fabricated using a metal lift-off process. This paper presents a demonstration of the SFIL technique for the patterning of the gate level in a functional MOSFET device.

Paper Details

Date Published: 16 June 2003
PDF: 6 pages
Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); doi: 10.1117/12.490142
Show Author Affiliations
Britain J. Smith, Univ. of Texas at Austin (United States)
Nicholas A. Stacey, Univ. of Texas at Austin (United States)
J. P. Donnelly, Univ. of Texas at Austin (United States)
David M. Onsongo, Univ. of Texas at Austin (United States)
Todd C. Bailey, Univ. of Texas at Austin (United States)
Chris J. Mackay, Molecular Imprints, Inc. (United States)
Douglas J. Resnick, Motorola, Inc. (United States)
William J. Dauksher, Motorola, Inc. (United States)
David P. Mancini, Motorola, Inc. (United States)
Kevin J. Nordquist, Motorola, Inc. (United States)
S. V. Sreenivasan, Molecular Imprints, Inc. (United States)
Sanjay K. Banerjee, Univ. of Texas at Austin (United States)
John G. Ekerdt, Univ. of Texas at Austin (United States)
Grant C. Willson, Univ. of Texas at Austin (United States)

Published in SPIE Proceedings Vol. 5037:
Emerging Lithographic Technologies VII
Roxann L. Engelstad, Editor(s)

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