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Proceedings Paper

Design and performance of a step and repeat imprinting machine
Author(s): Ian McMackin; Philip Schumaker; Daniel Babbs; Jin Choi; Wenli Collison; S. V. Sreenivasan; Norman E. Schumaker; Michael P. C. Watts; Ronald D. Voisin
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Paper Abstract

Molecular Imprints, Inc. (MII) has developed the ImprioTM 100, which is the first commercial step and repeat imprint lithography system with field-to-field alignment. This system is designed to implement the UV curable nano-replication capability of the Step and FlashTM Imprint Lithography (S-FILTM) process. To-date, the Imprio 100 system has demonstrated: 1) Full 200 mm wafer coverage with lithographically useful patterning; 2) Full wafer residual thickness control to enable practical etching (thickness variation < 50 nm, 3 sigma); 3) Field edge control compatible with 50 um kerf regions. 4) Multi-day CD uniformity measured on an analytical SEM < 2 nm, 3 sigma with no process adjustments; 5) Etch pattern transfer including break-through etch of residual material, followed by a bi-layer etch through thick planarization layers; 6) Initial level-to-level alignment target acquisition with accuracy of better than 100 nm. 7) Low air borne particle counts in tool microenvironment consistent with Class 0.1 while imprinting.

Paper Details

Date Published: 16 June 2003
PDF: 9 pages
Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); doi: 10.1117/12.490133
Show Author Affiliations
Ian McMackin, Molecular Imprints, Inc. (United States)
Philip Schumaker, Molecular Imprints, Inc. (United States)
Daniel Babbs, Molecular Imprints, Inc. (United States)
Jin Choi, Molecular Imprints, Inc. (United States)
Wenli Collison, Lam Research Corp. (United States)
S. V. Sreenivasan, Molecular Imprints, Inc. (United States)
Norman E. Schumaker, Molecular Imprints, Inc. (United States)
Michael P. C. Watts, Molecular Imprints, Inc. (United States)
Ronald D. Voisin, Molecular Imprints, Inc. (United States)

Published in SPIE Proceedings Vol. 5037:
Emerging Lithographic Technologies VII
Roxann L. Engelstad, Editor(s)

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