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Proceedings Paper

Defect reduction strategies for submicron manufacturing: tools and methodologies
Author(s): Robyn Sue Coleman; Prasanna R. Chitturi
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Paper Abstract

Reducing and controlling defect densities is critical to the successful manufacture of semiconductor devices. Automated wafer inspection tools detecting smaller defects and providing more consistent results L2than previous techniques are being used more and more in this effort. In order to use these tools effectively a structured approach must be taken. In addition understanding the performance ofthe automated inspection tool is key to correctly interpreting the information it provides. This paper will describe a defect reduction methodology employing an automated wafer inspection tool which has been successfully applied by several semiconductor manufacturers. The critical aspects of applying such a program are discussed in a case study format. The second portion of this paper presents possible barriers to a succesful defect reduction program. The organizational elements of a successful program are discussed. A methodology for evaluating the performance of an automated wafer inspection tool is outlined. The design of a test vehicle useful for tool characterization is described. Parameters which have been shown to have significant impact on the performance of wafer inspection tools are identified. Data illustrating the methodology is presented.

Paper Details

Date Published: 1 March 1991
PDF: 12 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48956
Show Author Affiliations
Robyn Sue Coleman, KLA Instruments Corp. (United States)
Prasanna R. Chitturi, KLA Instruments Corp. (United States)

Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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