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Proceedings Paper

In-situ film thickness measurements using acoustic techniques
Author(s): Sanjay Bhardwaj; Butrus T. Khuri-Yakub
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Paper Abstract

Process monitoring and control of semiconductor fabrication parameters like film thickness are important issues limited at the present time by a lack of adequate sensors. In this paper we outline the limitations of current film thickness technology and propose two new methods for nondestructive insitu film thickness process monitoring: acoustic time domain reflectometry (TDR) and acoustic reflection coefficient phase measurements. Theoretical calculations and experimental measurements of different metal films are used to demonstrate the viability of these novel techniques.

Paper Details

Date Published: 1 March 1991
PDF: 8 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48949
Show Author Affiliations
Sanjay Bhardwaj, Stanford Univ. (United States)
Butrus T. Khuri-Yakub, Stanford Univ. (United States)

Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)

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