Proceedings Paper
Effects of environmental and installation-specific factors on process gas delivery via mass-flow controller with an emphasis on real-time behavior| Format | Member Price | Non-Member Price |
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Paper Abstract
The use of the thermal transport mass flow controller (MFC) is currently the method of choice for gas delivery in semiconductor processes. Many environmental and installation factors influence the operational behavior of these MFCs and may cause a significant deviation from their specified performance. The impact of several of these factors will be discussed. Some of the issues to be addressed include environmental temperature upstream pressure and regulation mixing manifolds and tubulation (gas system geometry). Flow parameters tested include average flow rate vs setpoint flow control time and maximum flow rate (switch-on transients). In addition qualitative observations concerning real time flow behavior will be made. Measurement techniques and other issues affecting gas delivery will also be discussed.
Paper Details
Date Published: 1 March 1991
PDF: 9 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48933
Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)
PDF: 9 pages
Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); doi: 10.1117/12.48933
Show Author Affiliations
David E. Gray, Lucas/Signatone Corp. (United States)
Neil M. P. Benjamin, Lucas/Signatone Corp. (United States)
Neil M. P. Benjamin, Lucas/Signatone Corp. (United States)
Brian N. Chapman, Lucas/Signatone Corp. (United States)
Published in SPIE Proceedings Vol. 1392:
Advanced Techniques for Integrated Circuit Processing
James A. Bondur; Terry R. Turner, Editor(s)
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