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Proceedings Paper

Overcoat materials for acrylate resists to enhance their resolution
Author(s): Koji Nozaki; Miwa Igarashi; Ei Yano; Hajime Yamamoto; Satoshi Takechi; Isamu Hanyu
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Paper Abstract

We have developed a series of water developable overcoat materials to enhance the resolution of acrylate resists. The overcoat materials are water solutions that consist of a water-soluble polymer, a cross-linker, and non-ionic surfactant with a small amount of IPA (2-propanol). They exhibit affinity for acrylate resists that make them penetrate and react at the surface of the patterned resists. The resolution of the resist can be improved below the resolution limit of the exposure wavelengths by using the optimized materials. Additionally, the line edge roughness of the resist patterns can be reduced with only a small change in the pattern size when a low baking temperature (<95°C) and/or a small change of the composition of the material is applied. These materials are compatible with both acrylate-based 193-nm chemically amplified resists and PMMA (poly(methyl methacrylate)) resists. This indicates that the reaction can proceed even without acids, which are generally generated from photo acid generators (PAGs). The opitimized material affords sub 100-nm patterns for hole and L/S (line and space) with an alicyclic acrylate resist. A 28-nm shrinkage is also obtained with a PMMA resist to formulate the 68-nm trench pattern.

Paper Details

Date Published: 12 June 2003
PDF: 10 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.487727
Show Author Affiliations
Koji Nozaki, Fujitsu Labs. Ltd. (Japan)
Miwa Igarashi, Fujitsu Labs. Ltd. (Japan)
Ei Yano, Fujitsu Labs. Ltd. (Japan)
Hajime Yamamoto, Fujitsu Ltd. (Japan)
Satoshi Takechi, Fujitsu Ltd. (Japan)
Isamu Hanyu, Fujitsu Ltd. (Japan)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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