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Proceedings Paper

Three-dimensional ladar focal plane array development at Rockwell Scientific: an update
Author(s): Mohan Vaidyanathan; Song Xue; Kenneth Johnson; John Blackwell; Majid Zandian; Benji Hanyaloglu; Lester Kozlowski; Gary Hughes; John Montroy; Kadri Vural
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Paper Abstract

We have developed a three-dimensional (3D) imaging ladar focal plane array (FPA) for military and commercial applications. The FPA provides snap-shot, direct detection, high-resolution range and range-sampled intensity imaging capability on a single chip. The FPA is made of a 64x64 element, 100-μm pixel pitch detector array that is directly bump bonded to a matched CMOS based silicon readout integrated circuit (ROIC) with parallel ladar signal processing at each pixel. A room temperature, SWIR InGaAs detector variant for imaging near 1.5-μm wavelengths and a cooled MWIR HgCdTe detector variant for imaging near 3-μm to 5-μm wavelengths have been fabricated. We have built a prototype SWIR FPA, integrated it to a compact, transportable SWIR flash ladar transceiver, and collected initial range images outdoors. We present the measured performances of the detector, the readout, and the image data collected with the focal plane array.

Paper Details

Date Published: 21 August 2003
PDF: 8 pages
Proc. SPIE 5086, Laser Radar Technology and Applications VIII, (21 August 2003); doi: 10.1117/12.487211
Show Author Affiliations
Mohan Vaidyanathan, Rockwell Scientific Co. (United States)
Song Xue, Rockwell Scientific Co. (United States)
Kenneth Johnson, Rockwell Scientific Co. (United States)
John Blackwell, Rockwell Scientific Co. (United States)
Majid Zandian, Rockwell Scientific Co. (United States)
Benji Hanyaloglu, Rockwell Scientific Co. (United States)
Lester Kozlowski, Rockwell Scientific Co. (United States)
Gary Hughes, Rockwell Scientific Co. (United States)
John Montroy, Rockwell Scientific Co. (United States)
Kadri Vural, Rockwell Scientific Co. (United States)

Published in SPIE Proceedings Vol. 5086:
Laser Radar Technology and Applications VIII
Gary W. Kamerman, Editor(s)

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