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Proceedings Paper

Machining of micro-through-holes on glass plate by femtosecond laser pulses
Author(s): Motohiro Yasui; Hikoharu Aoki; Isamu Miyamoto
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Paper Abstract

Lime-glass and silica-glass plates with thickness of 100 μm were drilled with a ultra-short pulse laser(780nm, 150fs pulses at 1kHz). The surface of the glass plate at front side and rear side were observed by SEM, and the transmitted laser power though the glass plate was measured for both of glass. The appearance of the drilled hole of lime-glass was compared with that of silica-glass. The drilling characteristics of lime-glass and silica-glass plates with thickness of 100 μm by femto-second laser pulse were studied. On rear side, the crack occurred before drilling through the plate. The crack on the rear side occurred in lime-glass at smaller shot number than in silica-glass. The transmitted laser power ratio was decreased with increasing laser intensity. Interesting phenomenon that the lower glass plate began to be drilled before the upper glass plate was drilled through, when two glass plates with air gap of 12 μm were drilled.

Paper Details

Date Published: 19 February 2003
PDF: 5 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486594
Show Author Affiliations
Motohiro Yasui, Brother Industrial Co., Ltd. (Japan)
Hikoharu Aoki, Brother Industrial Co., Ltd. (Japan)
Isamu Miyamoto, Osaka Univ. (Japan)

Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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