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Proceedings Paper

Laser adjustment of beryllium copper sheet using temperature gradient mechanism
Author(s): Kosaku Kitada; Nobuyuki Asahi
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Paper Abstract

In order to realize a micro mechanical relay, a new technology of adjusting the characteristics of relays by laser has been developed. While IT-related mechanical relays have been increasingly miniaturized, the mechanical adjustment system by using the conventional spring material bending has already come to its limit in the adjustment process of relays. In attempt to overcome this situation, the application of laser forming, which is able to deal with miniaturization and is not influenced by spring back, was examined. However, as the beam spring used for relays involves a thin thickness and high thermal conductivity, the conventional technique of repeating laser irradiation, which induces damage of the surface and residual stress, to the same parts couldn’t adjust the displacement with accuracy. A technique that changes beam path in repeating laser irradiations was then applied. Consequently, with a minimal number of times of irradiation, the characteristics of relays can be adjusted by using laser without causing damage to the surface.

Paper Details

Date Published: 19 February 2003
PDF: 6 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486552
Show Author Affiliations
Kosaku Kitada, Matsushita Electric Works, Ltd. (Japan)
Nobuyuki Asahi, Matsushita Electric Works, Ltd. (Japan)

Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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