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Laser processing of polytetrafluoroethylene (Teflon) in air
Author(s): Z. B. Wang; Ming Hui Hong; Yong Feng Lu; Tow Chong Chong
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Paper Abstract

Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti:Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO2 laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluence below 5.0 J/cm2. For Nd:YAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO2 laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.

Paper Details

Date Published: 19 February 2003
PDF: 6 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486544
Show Author Affiliations
Z. B. Wang, Data Storage Institute/National Univ. of Singapore (Singapore)
Ming Hui Hong, Data Storage Institute/National Univ. of Singapore (Singapore)
Yong Feng Lu, National Univ. of Singapore (Singapore)
Tow Chong Chong, Data Storage Institute/National Univ. of Singapore (Singapore)

Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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