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Proceedings Paper

Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation
Author(s): Kosuke Kawahara; Yasunobu Kurogi; Naoyuki Matsuo; Takafumi Ninomiya; Hiroshi Sawada; Atsushi Yokotani; Kou Kurosawa
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Paper Abstract

Femtosecond laser has been expected as a new tool for the industrial usage in particular to material micromachining. We are developing the dicing technique with femtosecond laser ablation for the ultra thin semiconductor substrates, which are 50 μm thick or less. In this research, we performed drilling for 50 μm thick silicon substrate with femtosecond laser (π=120 fs, λ=800 nm, F=1 kHz) as the basic experiment for dicing, focusing on the influence of a double-pulse irradiation on the processing characteristics. The double-pulse irradiation for 18 shots of 10 μJ/pulse at the pulse separation time from 10 to 20 ps showed the remarkable reduction of the height of the molten layer around the drilled hole (<0.5 μm). At the same time, however, the ablation depth was the minimum (<2.3 μm). The surface inside the hole got smooth as the pulse separation time of more than 3 ps. We supposed that the second pulse in a double-pulse should generate the another ablation on the surface and its high pressure should prevent the ablated materials by the first pulse from flying out of the hole.

Paper Details

Date Published: 19 February 2003
PDF: 5 pages
Proc. SPIE 4830, Third International Symposium on Laser Precision Microfabrication, (19 February 2003); doi: 10.1117/12.486542
Show Author Affiliations
Kosuke Kawahara, NEC Machinery Corp. (Japan)
Yasunobu Kurogi, Miyazaki Univ. (Japan)
Naoyuki Matsuo, Miyazaki Univ. (Japan)
Takafumi Ninomiya, NEC Machinery Corp. (Japan)
Hiroshi Sawada, NEC Machinery Corp. (Japan)
Atsushi Yokotani, Miyazaki Univ. (Japan)
Kou Kurosawa, Miyazaki Univ. (Japan)

Published in SPIE Proceedings Vol. 4830:
Third International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Kojiro F. Kobayashi; Koji Sugioka; Reinhart Poprawe; Henry Helvajian, Editor(s)

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