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Proceedings Paper

Application of the electromechanical impedance method for the identification of in-situ stress in structures
Author(s): Chin-Wee Ong; Yaowen Yang; Akshay Surendra Kumar Naidu; Yong Lu; Chee Kiong Soh
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Paper Abstract

In the beginning, the electro-mechanical (EM) impedance method for structural health monitoring was recognized as a means of structural in-situ stress monitoring and measurement. Consequently, theoretical analysis based on the EM impedance method as a tool for in-situ stress identification in structural members was presented. A dynamic impedance model derived from the Euler-Bernoulli beam theory was developed to investigate the influence of in-situ stress on the dynamic and electro-mechanical response of a smart beam interrogated by a pair of symmetrically bounded, surface-bonded piezoceramic (PZT) transducers. Numerical simulation was performed for a laboratory sized smart beam subjected to a multitude of axial loads at the ends. It was found that natural frequency shifts takes place in the presence of in-situ stress. Furthermore, these shifts, which are linearly related to the magnitude of applied load, is directly reflected in the point-wise dynamic stiffness response. However, in terms of the electro-mechanical response, which can be measured directly, the shift of peaks of the EM admittance signature is not directly indicative of the natural frequency shifts. This arises as an inverse problem in engineering, which cannot be deciphered using direct approach. Back calculation of the in-situ stress using genetic algorithm (GA) was proposed.

Paper Details

Date Published: 14 November 2002
PDF: 12 pages
Proc. SPIE 4935, Smart Structures, Devices, and Systems, (14 November 2002); doi: 10.1117/12.485621
Show Author Affiliations
Chin-Wee Ong, Nanyang Technological Univ. (Singapore)
Yaowen Yang, Nanyang Technological Univ. (Singapore)
Akshay Surendra Kumar Naidu, Nanyang Technological Univ. (Singapore)
Yong Lu, Nanyang Technological Univ. (Singapore)
Chee Kiong Soh, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 4935:
Smart Structures, Devices, and Systems
Erol C. Harvey; Derek Abbott; Vijay K. Varadan, Editor(s)

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