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Proceedings Paper

Failure prediction across process window for robust OPC
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Paper Abstract

In conventional Optical and Process Correction (OPC), models are calibrated with the CD measurement from the “good” printable patterns. Predictions of process window loss are based on extrapolation from the “good” region into the failure region. The extrapolation is always a less accurate process than interpolation. In this paper, we utilize the experimental pass/fail data to build models that accurately identify and predict printing failures. We developed a methodology and a formal apparatus for failure modeling. It is found that two or more aerial image shape parameters are required to describe all failure mechanisms for a sub-100nm process. This empirical failure model is currently applied to Optical Rule Checking (ORC) of the post-OPC layout. It also can be used to constrain layout corrections in the future.

Paper Details

Date Published: 26 June 2003
PDF: 10 pages
Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); doi: 10.1117/12.485478
Show Author Affiliations
Shumay D. Shang, Mentor Graphics Corp. (United States)
Yuri Granik, Mentor Graphics Corp. (United States)
Nicolas B. Cobb, Mentor Graphics Corp. (United States)
Wilhelm Maurer, Mentor Graphics Corp. (United States)
Yuping Cui, IBM Corp. (United States)
Lars W. Liebmann, IBM Corp. (United States)
James M. Oberschmidt, IBM Corp. (United States)
Rama Nand Singh, IBM Thomas J. Watson Research Ctr. (United States)
Ben R. Vampatella, IBM Corp. (United States)


Published in SPIE Proceedings Vol. 5040:
Optical Microlithography XVI
Anthony Yen, Editor(s)

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