Share Email Print
cover

Proceedings Paper

Effects of soft pellicle frame curvature and mounting process on pellicle-induced distortions in advanced photomasks
Author(s): Eric P. Cotte; Roxann L. Engelstad; Edward G. Lovell; Daniel Tanzil; Florence O. Eschbach; Yulia O. Korobko; Minoru Fujita; Hiroaki Nakagawa
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Lithography registration errors induced by the attachment of soft pellicles on reticles can significantly affect wafer overlay performance for sub-90 nm lithography chip manufacturing. Intel Corporation, Mitsui Chemicals, and the University of Wisconsin Computational Mechanics Center (UW-CMC) have conducted an extensive experimental study to quantify and minimize the pellicle-induced distortions in order to meet advanced mask manufacturing requirements. A comprehensive design of experiment was elaborated to evaluate the effects of frame curvature, adhesive gasket compliance, and mounting load on pellicle-induced distortions for soft pellicle systems. A frame curvature measurement tool was custom-made at the UW-CMC, employing an MTI Instruments capacitive sensor. A TA Instruments dynamic mechanical analyzer was used to determine the elastic modulus of the adhesive gasket materials. Registration measurements were conducted by Intel on test reticles on a 21 × 21 array of grid points, before and after pellicle attachment, to obtain pellicle-induced distortion results. Results characterize the influence of attachment process, type of adhesive gasket, frame curvature, reticle guiding plate configuration, and attachment load on pellicle-induced distortions.

Paper Details

Date Published: 26 June 2003
PDF: 11 pages
Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); doi: 10.1117/12.485474
Show Author Affiliations
Eric P. Cotte, Univ. of Wisconsin/Madison (United States)
Roxann L. Engelstad, Univ. of Wisconsin/Madison (United States)
Edward G. Lovell, Univ. of Wisconsin/Madison (United States)
Daniel Tanzil, Intel Corp. (United States)
Florence O. Eschbach, Intel Corp. (United States)
Yulia O. Korobko, Intel Corp. (United States)
Minoru Fujita, Mitsui Chemicals, Inc. (Japan)
Hiroaki Nakagawa, Mitsui Chemicals, Inc. (Japan)


Published in SPIE Proceedings Vol. 5040:
Optical Microlithography XVI
Anthony Yen, Editor(s)

© SPIE. Terms of Use
Back to Top