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Proceedings Paper

Negative tone 193-nm photoresists
Author(s): Nick Pugliano; Patrick J. Bolton; Tony Barbieri; Matt King; Michael T. Reilly; William Lawrence; Doris Kang; George G. Barclay
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Paper Abstract

Recently several authors have specifically noted the advantages of using negative tone resists for patterning narrow trenches. The growing interest stems from several factors. Firstly aerial image models indicate that negative tone systems should have improved process windows for patterning narrow trenches, relative to their positive tone counterparts. Secondly, negative tone resists are thought to be advantageous for minimizing variations of CD through pitch for trench layers thus reducing the optical proximity effect for certain exposure conditions. Finally, negative tone systems arguably circumvent the issue of resist poisoning from low k dielectric materials. The combination of these arguments has warranted our effort in the development of negative tone 193 nm resist systems, and this submission will present recent advances in this area. In particular the presentation will focus on prototypical negative tone formulations for use in patterning trenches with bright field imaging. We will present our results on a variety of performance attributes such as dissolution behavior, LER control, etch performance, resolution and process windows for these systems and we will provide a materials basis for using negative tone systems for patterning trenches for back end layers.

Paper Details

Date Published: 12 June 2003
PDF: 7 pages
Proc. SPIE 5039, Advances in Resist Technology and Processing XX, (12 June 2003); doi: 10.1117/12.485075
Show Author Affiliations
Nick Pugliano, Shipley Co. Inc. (United States)
Patrick J. Bolton, Shipley Co. Inc. (United States)
Tony Barbieri, Shipley Co. Inc. (United States)
Matt King, Shipley Co. Inc. (United States)
Michael T. Reilly, Shipley Co. Inc. (United States)
William Lawrence, Shipley Co. Inc. (United States)
Doris Kang, Shipley Co. Inc. (United States)
George G. Barclay, Shipley Co. Inc. (United States)

Published in SPIE Proceedings Vol. 5039:
Advances in Resist Technology and Processing XX
Theodore H. Fedynyshyn, Editor(s)

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