We reported the Guideline(Ver.1) of Reticle Data Management (RDM) Activity in 2001. Among we have been focused SoC(System on Chip) Business, we have been improved the efficiency over Design technology, Mask manufacturing and Wafer manufacturing. Especially, These subjects have been the lithography Cost including Reticle Cost, shorter life cycle of product, more difficult technique, lower cost and shorter total TAT from design to chip shipping. Guideline Ver1.0 announced the standardization of interface contents over Design to Mask manufacture, and to wafer manufacture. Guideline Ver2.0 will announce this RDM activity has been developed the optimization of a new engineering chain management in addition to the pattern data and the linkage to EDA in 2003.

Date Published: 26 June 2003
PDF: 12 pages
Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); doi: 10.1117/12.484438

Published in SPIE Proceedings Vol. 5040:
Optical Microlithography XVI
Anthony Yen, Editor(s)