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Proceedings Paper

Design and simulation of a bulk micromachined relay with lateral contact
Author(s): Zhenchuan Yang; Zhihong Li; Yilong Hao; Guoying Wu
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Paper Abstract

A bulk micromachined relay with lateral contact structure is presented in this paper. The relay is fabricated with glass/silicon wafer bonding and deep reactive ion etching (DRIE) process. it is laterally driven with electrostatic actuator. The threshold voltage of the relay is simulated using Reduced Order Modeling (ROM) methods provided by a general finite element simulator, ANSYSTM. The simulated result and experimental result are compared and discussed

Paper Details

Date Published: 10 September 2002
PDF: 4 pages
Proc. SPIE 4928, MEMS/MOEMS Technologies and Applications, (10 September 2002); doi: 10.1117/12.483185
Show Author Affiliations
Zhenchuan Yang, Peking Univ. (China)
Zhihong Li, Peking Univ. (China)
Yilong Hao, Peking Univ. (China)
Guoying Wu, Peking Univ. (China)

Published in SPIE Proceedings Vol. 4928:
MEMS/MOEMS Technologies and Applications
Guofan Jin; John S. McKillop; Kazuhiro Hane, Editor(s)

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