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Proceedings Paper

Laser micromachining in the microelectronics industry
Author(s): Yunlong Sun; Edward J. Swenson
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Paper Abstract

The use of lasers in microelectronics production for trimming, link cutting, ablating, drilling and general “micromachining” continues to grow. Several new technologies, such as alternative wavelength processing and shaped, uniform laser spots have produced better processing quality, higher reliability, and greater yields. This paper will review the latest technologies of laser micro-machining in microelectronics. Laser drilling for printed circuit board will be dressed in another paper.

Paper Details

Date Published: 12 September 2002
PDF: 6 pages
Proc. SPIE 4915, Lasers in Material Processing and Manufacturing, (12 September 2002); doi: 10.1117/12.482886
Show Author Affiliations
Yunlong Sun, Electro Scientific Industries, Inc. (United States)
Edward J. Swenson, Electro Scientific Industries, Inc. (United States)

Published in SPIE Proceedings Vol. 4915:
Lasers in Material Processing and Manufacturing
ShuShen Deng; Tatsuo Okada; Klaus Behler; XingZong Wang, Editor(s)

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