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Proceedings Paper

Development of a MEMS device for acoustic emission testing
Author(s): Didem Ozevin; Stephen P. Pessiki; Akash Jain; David W. Greve; Irving J. Oppenheim
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Paper Abstract

Acoustic emission testing is an important technology for evaluating structural materials, and especially for detecting damage in structural members. Significant new capabilities may be gained by developing MEMS transducers for acoustic emission testing, including permanent bonding or embedment for superior coupling, greater density of transducer placement, and a bundle of transducers on each device tuned to different frequencies. Additional advantages include capabilities for maintenance of signal histories and coordination between multiple transducers. We designed a MEMS device for acoustic emission testing that features two different mechanical types, a hexagonal plate design and a spring-mass design, with multiple detectors of each type at ten different frequencies in the range of 100 kHz to 1 MHz. The devices were fabricated in the multi-user polysilicon surface micromachining (MUMPs) process and we have conducted electrical characterization experiments and initial experiments on acoustic emission detection. We first report on C(V) measurements and perform a comparison between predicted (design) and measured response. We next report on admittance measurements conducted at pressures varying from vacuum to atmospheric, identifying the resonant frequencies and again providing a comparison with predicted performance. We then describe initial calibration experiments that compare the performance of the detectors to other acoustic emission transducers, and we discuss the overall performance of the device as a sensor suite, as contrasted to the single-channel performance of most commercial transducers.

Paper Details

Date Published: 18 August 2003
PDF: 11 pages
Proc. SPIE 5057, Smart Structures and Materials 2003: Smart Systems and Nondestructive Evaluation for Civil Infrastructures, (18 August 2003); doi: 10.1117/12.482383
Show Author Affiliations
Didem Ozevin, Lehigh Univ. (United States)
Stephen P. Pessiki, Lehigh Univ. (United States)
Akash Jain, Carnegie Mellon Univ. (United States)
David W. Greve, Carnegie Mellon Univ. (United States)
Irving J. Oppenheim, Carnegie Mellon Univ. (United States)

Published in SPIE Proceedings Vol. 5057:
Smart Structures and Materials 2003: Smart Systems and Nondestructive Evaluation for Civil Infrastructures
Shih-Chi Liu, Editor(s)

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