Share Email Print

Proceedings Paper

Advances in light-curing adhesives: II. Solutions designed for automation
Author(s): Andy Bachmann
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The promise of photonics is to provide the next affordable leap in communications and information technology. Low yields and high unit costs are a barrier to mass production. Assembling photonic components economically represents one of the most demanding manufacturing processes in industry today due to the challenges in yield, cycle time and material costs. Manually assembling photonic components will not support the industry's growth rate. Achieving the promise of long term success demands successful automation strategy. Understanding cycle time and throughput and focusing on yield will allow the development of the lowest cost, most successful assembly of photonic, as well as electronic, components.

Paper Details

Date Published: 9 September 2002
PDF: 9 pages
Proc. SPIE 4771, Optomechanical Design and Engineering 2002, (9 September 2002); doi: 10.1117/12.482156
Show Author Affiliations
Andy Bachmann, Dymax Corp. (United States)

Published in SPIE Proceedings Vol. 4771:
Optomechanical Design and Engineering 2002
Alson E. Hatheway, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?