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Proceedings Paper

Water jet guided laser versus saw dicing
Author(s): Natalia M. Dushkina; Frank Ruediger Wagner; Christophe Boillat; Jean-Marie Buchilly; Bernold Richerzhagen
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Paper Abstract

The incessantly growing demands for higher speed of the wireless telecommunications and more compact devices require using of thin compound semiconductor wafers. The dicing is the very last process of the wafer manufacturing. At this stage the IC pattern is completely built up and the wafer has the highest value. Therefore, the goal of the singulation process is to provide the highest possible throughput. The conventional saw techniques "struggle" at their speed limits, while the conventional laser is not an appropriate dicing tool due to the strong thermal effect and big heat affected zones. The water-jet guided laser technology provides cool laser dicing since the laser is coupled in a fine stable water-jet and conducted to the work piece by means of total internal reflection like through an optical fiber, as the relatively low water pressure (10 - 30 MPa) of the tiny jet with diameter 40 - 100 μm results in a negligible force on the sample. This technology provides higher cutting speeds and burr-free kerf quality. By means of the Laser MicroJet, wafers as thin as 25 μm could be diced in streets of 50 μm width, with almost 100% wafer throughput. Here we compare the water-jet guided laser cutting with conventional techniques for dicing of thin semiconductor wafers. The results for Silicon and GaAs/Ge wafers are discussed in terms of speed, kerf quality and die fracture strength.

Paper Details

Date Published: 17 October 2003
PDF: 11 pages
Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); doi: 10.1117/12.479414
Show Author Affiliations
Natalia M. Dushkina, Gem City Engineering Co. (United States)
Frank Ruediger Wagner, Synova SA (Switzerland)
Christophe Boillat, Synova SA (Switzerland)
Jean-Marie Buchilly, Synova SA (Switzerland)
Bernold Richerzhagen, Synova SA (Switzerland)

Published in SPIE Proceedings Vol. 4977:
Photon Processing in Microelectronics and Photonics II
Alberto Piqué; David B. Geohegan; Friedrich G. Bachmann; Koji Sugioka; Frank Träger; Jan J. Dubowski; Peter R. Herman; Willem Hoving; Kouichi Murakami; Kunihiko Washio; Jim Fieret, Editor(s)

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