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OPC aware mask and wafer metrology
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Paper Abstract

Lithography at its limit of resolution is a highly non- linear pattern transfer process. Typically the shapes of printed features deviate considerably from their corresponding features in the layout. This deviation is known as Optical Proximity Effect, and its correction Optical Proximity effect Correction or OPC. Although many other so-called optical enhancement technologies are applied to cope with the issues of lithography at its limit of resolution, almost none of these can re-store the linearity of the pattern transfer. Hence fully functional OPC has become a very basic requirement for current and future lithography processes. In general, proximity effects are two-dimensional (2d) effects. Thus any measurement of proximity effects or any characterization of the effectiveness of OPC has to be two- dimensional. As OPC modifies shapes in the data for mask writing in a way to compensate for the expected proximity effects of the following processing steps, parameters describing the particular OPC-mask quality is a major concern. One-dimensional mask specifications, such as linewidth mean-to-target and uniformity, pattern placement, and maximum size of a tolerable defect, are not sufficient anymore to completely describe the functionality of a given mask for OPC. Two-dimensional mask specifications need to be evaluated. We present in this paper a basic concept for 2d metrology. Examples for 2d measurements to assess the effectiveness of OPC are given by the application of an SEM Image Analysis tool to an advanced 130nm process.

Paper Details

Date Published: 16 August 2002
PDF: 7 pages
Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); doi: 10.1117/12.479350
Show Author Affiliations
Wilhelm Maurer, KLA Tencor Corp. (United States)
Vincent Wiaux, IMEC (Belgium)
Rik M. Jonckheere, IMEC (Belgium)
Vicky Philipsen, IMEC (Belgium)
Thomas Hoffmann, IMEC (Belgium)
Staf Verhaegen, IMEC (Belgium)
Kurt G. Ronse, IMEC (Belgium)
Jonathan G. England, KLA-Tencor Corp. (United Kingdom)
William B. Howard, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 4764:
18th European Conference on Mask Technology for Integrated Circuits and Microcomponents
Uwe F. W. Behringer, Editor(s)

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