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Proceedings Paper

Chemical mechanical planarization: an effective microfabrication and micromachining technology for MEMS
Author(s): Juikun Lee; Ronald Myers; Tina Dear; Carl Gensler
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Paper Abstract

Chemical mechanical planarization (CMP) is an integral process in the semiconductor industry that enables the fabrication of advanced integrated circuit (IC) components. It is the method of choice for obtaining both local and global planarization of IC thin films, including metals, such as copper, aluminum and tungsten, and dielectrics such as silicon dioxide. An emerging area for application of CMP is in Micro-Electro-Mechanical Systems (MEMS). Fabricated from a variety of materials, including polymers, metals and ceramics, MEMS devices present new opportunities and new challenges for CMP. This paper describes the planarization and fabrication requirements of MEMS CMP, from both a materials and a processing perspective, with a comparison to IC CMP. Examples using popular MEMS fabrication materials, such as standard and photosensitive polyimides, alumina and copper, will demonstrate the efffectiveness of CMP for microfabrication and micromachining applications. Additional results will illustrate the use of CMP as a means to selectively and controllably effect a high degree of planarization efficiency on a variety of microelectronics substrates. Finally, the role of CMP in meeting future MEMS/MOEMS-related applications will be addressed.

Paper Details

Date Published: 15 January 2003
PDF: 10 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.478291
Show Author Affiliations
Juikun Lee, Cabot Microelectronics Corp. (United States)
Ronald Myers, Cabot Microelectronics Corp. (United States)
Tina Dear, Cabot Microelectronics Corp. (United States)
Carl Gensler, Cabot Microelectronics Corp. (United States)

Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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