Proceedings Paper
Methods for comparative analysis of waveform degradation in electrical and optical high-performance interconnections| Format | Member Price | Non-Member Price |
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Paper Details
Date Published: 1 April 1991
PDF: 73 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.47727
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
PDF: 73 pages
Proc. SPIE 1390, Microelectronic Interconnects and Packages: System and Process Integration, (1 April 1991); doi: 10.1117/12.47727
Show Author Affiliations
Henri Merkelo, Univ. of Illinois/Urbana-Champaign (United States)
B. D. McCredie, Univ. of Illinois/Urbana-Champaign (United States)
M. S. Veatch, Univ. of Illinois/Urbana-Champaign (United States)
B. D. McCredie, Univ. of Illinois/Urbana-Champaign (United States)
M. S. Veatch, Univ. of Illinois/Urbana-Champaign (United States)
D. L. Quinn, Univ. of Illinois/Urbana-Champaign (United States)
M. Dorneich, Univ. of Illinois/Urbana-Champaign (United States)
Yutaka Doi, Motorola, Inc. (United States)
M. Dorneich, Univ. of Illinois/Urbana-Champaign (United States)
Yutaka Doi, Motorola, Inc. (United States)
Published in SPIE Proceedings Vol. 1390:
Microelectronic Interconnects and Packages: System and Process Integration
Stuart K. Tewksbury; John R. Carruthers, Editor(s)
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