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Proceedings Paper

High-performance DUV inspection system for 100-nm generation masks
Author(s): Hideo Tsuchiya; Ikunao Isomura; Kazuhiro Nakashima; Kyoji Yamashita; Toshiyuki Watanabe; Takeshi Nishizaka; Hiroyuki Ikeda; Eiji Sawa; Masami Ikeda
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Paper Abstract

Mask inspection has become a much more important factor in LSI manufacturing. In order to perform mask inspection with high reliability for devices of 100-130 nm rule and below, a high-resolution and high-speed die-to-database inspection system is indispensable. In order to satisfy these requirements, the Toshiba MC-3500, a next-generation mask inspection system using 257nm DUV short wavelength optics, has been developed. The MC-3500 employs a die-to-database comparison method and a high-performance data processing system that is newly developed. This paper reports the system configuration, basic characteristics for defect detection and inspection performance.

Paper Details

Date Published: 1 August 2002
PDF: 8 pages
Proc. SPIE 4754, Photomask and Next-Generation Lithography Mask Technology IX, (1 August 2002); doi: 10.1117/12.476961
Show Author Affiliations
Hideo Tsuchiya, Toshiba Corp. (Japan)
Ikunao Isomura, Toshiba Corp. (Japan)
Kazuhiro Nakashima, Toshiba Corp. (Japan)
Kyoji Yamashita, Toshiba Corp. (Japan)
Toshiyuki Watanabe, Toshiba Corp. (Japan)
Takeshi Nishizaka, Toshiba Corp. (Japan)
Hiroyuki Ikeda, Toshiba Corp. (Japan)
Eiji Sawa, Toshiba Corp. (Japan)
Masami Ikeda, Toshiba Machine Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 4754:
Photomask and Next-Generation Lithography Mask Technology IX
Hiroichi Kawahira, Editor(s)

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