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Proceedings Paper

MEMS packaging efforts at Sandia National Laboratories
Author(s): Jonathan S. Custer
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Paper Abstract

Sandia National Laboratories has programs covering a broad range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad range of applications, including sensors, actuators, optics, and microfluidics. As these technologies have moved from the research to the prototype product stage, packaging has been required to develop new capabilities to integrated MEMS and other technologies into functional microsystems. This paper discusses several of Sandia’s MEMS packaging efforts, focusing mainly on inserting Sandia’s SUMMiT V (5-level polysilicon) surface micromachining technology into fieldable microsystems.

Paper Details

Date Published: 16 January 2003
PDF: 12 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.476331
Show Author Affiliations
Jonathan S. Custer, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

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