Share Email Print

Proceedings Paper

Characterizing the process window of a double-exposure dark-field alternating phase-shift mask
Author(s): Chris A. Mack
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

After reviewing the normal approach to process window characterization and analysis used for a standard single exposure process, the applicability of that approach to a double exposure process is investigated. By properly designing the binary trim mask for a double exposure dark field alternating phase shift mask process, the influence of the trim exposure step on the final gate CD can be minimized. Flare during the rim exposure, however, is found to cause an undesired coupling of the two exposure steps. A method of accounting for this coupling effect for the gate CD process window is given.

Paper Details

Date Published: 12 July 2002
PDF: 11 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475680
Show Author Affiliations
Chris A. Mack, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Alexander Starikov; Kenneth W. Tobin Jr., Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?