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Proceedings Paper

Wafer-level fault detection and classification on a photo track in a high volume fab
Author(s): Timothy L. Jackson; Richard J. Markle; Clinton W. Miller; Edward C. Stewart; Robert A. Crowell
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Paper Abstract

We will discuss Advanced Micro Devices's (AMD) Fault Detection and Classification (FDC) program strategy and our six-step project template that we have identified that must be addressed for any successful FDC effort. We will discuss the recent development and implementation of a wafer-level FDC system on a TEL CLEAN TRAC ACT 8 photo track system in AMD's Fab25, a high volume microprocessor factory. We will present our approach to designing and implementing this FDC system and demonstrate its ability to automatically identify specific wafers within a lot that require manual review. Upon manual review, the decision can be made to rework the specific wafers or the lot.

Paper Details

Date Published: 12 July 2002
PDF: 8 pages
Proc. SPIE 4692, Design, Process Integration, and Characterization for Microelectronics, (12 July 2002); doi: 10.1117/12.475649
Show Author Affiliations
Timothy L. Jackson, Advanced Micro Devices, Inc. (United States)
Richard J. Markle, Advanced Micro Devices, Inc. (United States)
Clinton W. Miller, Advanced Micro Devices, Inc. (United States)
Edward C. Stewart, Advanced Micro Devices, Inc. (United States)
Robert A. Crowell, Tokyo Electron America (United States)

Published in SPIE Proceedings Vol. 4692:
Design, Process Integration, and Characterization for Microelectronics
Alexander Starikov; Alexander Starikov; Kenneth W. Tobin Jr., Editor(s)

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