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Proceedings Paper

Flexible scalable photonic manufacturing method
Author(s): Timothy A. Skunes; Steven K. Case
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Paper Abstract

A process for flexible, scalable photonic manufacturing is described. Optical components are actively pre-aligned and secured to precision mounts. In a subsequent operation, the mounted optical components are passively placed onto a substrate known as an Optical Circuit Board (OCB). The passive placement may be either manual for low volume applications or with a pick-and-place robot for high volume applications. Mating registration features on the component mounts and the OCB facilitate accurate optical alignment. New photonic circuits may be created by changing the layout of the OCB. Predicted yield data from Monte Carlo tolerance simulations for two fiber optic photonic circuits is presented.

Paper Details

Date Published: 30 May 2003
PDF: 9 pages
Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); doi: 10.1117/12.475475
Show Author Affiliations
Timothy A. Skunes, Avanti Optics Corp. (United States)
Steven K. Case, Avanti Optics Corp. (United States)

Published in SPIE Proceedings Vol. 4997:
Photonics Packaging and Integration III
Randy A. Heyler; David J. Robbins; Ghassan E. Jabbour, Editor(s)

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