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Proceedings Paper

New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards
Author(s): Byung Sup Rho; Han Seo Cho; Ji-Young Eo; Saekyoung Kang; Hyo-Hoon Park; Young Woo Kim; Young Sang Joe; Dok Jin Yang
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Paper Abstract

We demonstrated a new architecture of the optical interconnection system which can be applied in the waveguide-embedded optical printed circuit board (PCB). We used 45° ended optical connection rods as a medium to guide light paths perpendicularly between surface-emitting lasers (or photodiode) and waveguides. A polymer film of multimode waveguides with cores of 100μm x 65μm was sandwiched between conventional PCBs. We made through-holes with a diameter of ~140μm on the PCB, passing through the waveguide cores, using Ti-sapphire laser drill. The optical rods were made of the segment of multimode silica fiber ribbon. One end of the fiber segment was cut with 45° and the other end with 90° by using the high power laser cutting technique. These fiber rods were inserted into the through-holes formed in the PCB, adjusting the insertion depth to locate the 45°-end of rods near the waveguide core. From this interconnection system, we achieved 12channels optical transmission link through a waveguide with a channel pitch of 250μm in the optical PCB. This new interconnection structure using the optical connection rods is well compatible with the fabrication processes of conventional electronic PCB which is employing the through-hole formation by laser drill and the lamination of plastic films by compression.

Paper Details

Date Published: 30 May 2003
PDF: 8 pages
Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); doi: 10.1117/12.475472
Show Author Affiliations
Byung Sup Rho, Information and Communications Univ. (South Korea)
Han Seo Cho, Information and Communications Univ. (South Korea)
Ji-Young Eo, Information and Communications Univ. (South Korea)
Saekyoung Kang, Information and Communications Univ. (South Korea)
Hyo-Hoon Park, Information and Communications Univ. (South Korea)
Young Woo Kim, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Young Sang Joe, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Dok Jin Yang, Samsung Electro-Mechanics Co., Ltd. (South Korea)

Published in SPIE Proceedings Vol. 4997:
Photonics Packaging and Integration III
Randy A. Heyler; David J. Robbins; Ghassan E. Jabbour, Editor(s)

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