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Proceedings Paper

Influence of target temperature on sputter deposited Ti-Ni-Cu and Ti-Ni-Pd shape memory alloys
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Paper Abstract

Ti-Ni-Cu and Ti-Ni-Pd films are deposited on Si < 100 > substrate by d.c. magnetron sputtering technique. In this paper, the influence of target temperature on the properties of the film is discussed. The target temperature transitions from a low temperature value to a high temperature value during sputtering. As grown Ti-Ni-Cu films are amorphous and are crystallized by heating at 500 degreesC for 20 minutes in situ prior to removal from the sputtering system whereas, as grown Ti-Ni-Pd films are crystallized at 550 degrees C for one hour. DSC and electrical resistivity measurements are used to determine the transformation temperature whereas, TEM and XRD are used for structural characterization and composition of the film is determined by using EDAX. We find that the transformation temperatures and the shape memory characteristics are strongly influenced by target temperature. The films show more uniform stoichiometry if the target is hot during deposition.

Paper Details

Date Published: 11 July 2002
PDF: 7 pages
Proc. SPIE 4699, Smart Structures and Materials 2002: Active Materials: Behavior and Mechanics, (11 July 2002); doi: 10.1117/12.474978
Show Author Affiliations
Kotekar Panduranga Mohanchandra, Mangalore Univ. (United States)
Ken K. Ho, Univ. of California/Los Angeles (United States)
Gregory Paul Carman, Univ. of California/Los Angeles (United States)

Published in SPIE Proceedings Vol. 4699:
Smart Structures and Materials 2002: Active Materials: Behavior and Mechanics
Christopher S. Lynch, Editor(s)

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