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Proceedings Paper

E-beam curing effects on the etch and CD-SEM stability of 193-nm resists
Author(s): Munirathna Padmanaban; Eric L. Alemy; Ralph R. Dammel; Woo-Kyu Kim; Takanori Kudo; Sang-Ho Lee; Douglas S. McKenzie; Aldo Orsi; Dalil Rahman; Wan-Lin Chen; Reza M. Sadjadi; William R. Livesay; Matthew F. Ross
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Paper Abstract

Electron beam (e-beam) curing techniques are known to improve etch and CD-SEM stability of 248 and 193nm resists. The effects of three different e-beam curing processes (standard, LT and ESC) on the methacrylate and hybrid type 193nm resists were studied with respect to resin chemistry changes, resist film shrinkage, pattern profiles, etch rates, and CD SEM stability. Both methacrylate and hybrid type 193nm resists lose carbonyl groups from the resins, with possibly a reduction in the free volume leading to improved etch resistance/selectivity. Methacrylate resist films shrink ca. 22-24% and hybrid resist films shrink ca. 23-27%. The LT process shrinks the least compared to the ESC and standard process. The ESC and LT processes were found to stabilize the patterns uniformly compared to the standard process. Etch rate, selectivity and resist surface roughness after etch of both methacrylate and hybrid resists were improved using the e-beam curing process. E-beam curing drastically reduces the CD SEM shrinkage (from ca. 15% to 2- 5%); however, considerable shrinkage occurs during the curing process itself.

Paper Details

Date Published: 24 July 2002
PDF: 9 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474262
Show Author Affiliations
Munirathna Padmanaban, Clariant Corp. (United States)
Eric L. Alemy, Clariant Corp. (United States)
Ralph R. Dammel, Clariant Corp. (United States)
Woo-Kyu Kim, Clariant Corp. (United States)
Takanori Kudo, Clariant Corp. (United States)
Sang-Ho Lee, Clariant Corp. (United States)
Douglas S. McKenzie, Clariant Corp. (United States)
Aldo Orsi, Clariant Corp. (United States)
Dalil Rahman, Clariant Corp. (United States)
Wan-Lin Chen, Lam Research Corp. (United States)
Reza M. Sadjadi, Lam Research Corp. (United States)
William R. Livesay, Electron Vision Corp. (United States)
Matthew F. Ross, Electron Vision Corp. (United States)

Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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