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Proceedings Paper

Measuring thermophysical properties of ultrathin photoresist films
Author(s): James N. D'Amour; Curtis W. Frank; Uzodinma Okoroanyanwu
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Paper Abstract

We have used ellipsometry to study the glass transition temperature (Tg) of thin films (thicknesses 4-300 nm) of monodisperse polystyrene (PS-M), polydisperse polystyrene (PS-P), and a Shipley photoresist base polymer (SBP) with and without photoacid generator (PAG) on silicon substrates. For films less than 40 nm thick, Tg values decreased with respect to their bulk values for PS-M and SBP films. Films containing PAG exhibited further reduction of Tg values as predicted by the Fox equation to within experimental error.

Paper Details

Date Published: 24 July 2002
PDF: 7 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474167
Show Author Affiliations
James N. D'Amour, Stanford Univ. (United States)
Curtis W. Frank, Stanford Univ. (United States)
Uzodinma Okoroanyanwu, Advanced Micro Devices, Inc. (United States)

Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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