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Proceedings Paper

EXCON: a graphics-based experiment-control manager
Author(s): Mumit Khan; Paul D. Anderson; Franco Cerrina
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Paper Abstract

EXCON is a software package developed to control and define the modeling of experiments. In this case, EXCON is used to integrate various individual modeling systems, in a user- definable manner, to simulate the semiconductor manufacturing process. These numerous systems model specific aspects of the integrated circuit fabrication process. Each can be a large complex software program requiring many system resources to reliably emulate the physical processes, in many cases at the atomic level, in an analytical manner. There are many different program data formats and user interfaces within the modeling systems used. EXCON addresses the automatic insertion of configuration and process data, the conversion of data formats between modeling systems, and the sequence of model execution. EXCON also has a mechanism to re-run the sequence of models with variations in one or several configuration or data parameters, thereby creating an environment to do controlled experiments. EXCON assists in the visualization of the data in the experimental data sequence. EXCON allows for coarse-grained parallelism by connecting processes with an interprocess and inter-machine communication mechanism, thereby allowing for concurrent execution of processes on multiple machines. System performance enhancement is done with a incremental directed graph analysis technique. EXCON will, when appropriate, transparently convert file formats between modeling systems.

Paper Details

Date Published: 1 August 1991
PDF: 9 pages
Proc. SPIE 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing, (1 August 1991); doi: 10.1117/12.47367
Show Author Affiliations
Mumit Khan, Univ. of Wisconsin/Madison (United States)
Paul D. Anderson, Univ. of Wisconsin/Madison (United States)
Franco Cerrina, Univ. of Wisconsin/Madison (United States)

Published in SPIE Proceedings Vol. 1465:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing
Martin C. Peckerar, Editor(s)

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