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Proceedings Paper

New crossbeam inspection tool combining an ultrahigh-resolution field emission SEM and a high-resolution FIB
Author(s): Peter Gnauck; Peter Hoffrogge; Jens Greiser
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Paper Abstract

The combination of field emission scanning electron microscopy (FESEM) and focused ion beam (FIB) is a future key technology for semiconductor and material science related applications. A new CrossBeam tool is discussed in this presentation. Through the combination of the well known Gemini ultrahigh resolution field emission SEM column and the well known Canion31 + high performance FIB column a wide field of applications can now be accessed. This includes structural cross-sections for SEM and transmission electron microscopy (TEM) applications, device modification, failure analysis, sublayer measurement and examination, as well as SEM and FIB related analytical techniques such as energy dispersive x-ray spectroscopy (EDS), wavelength dispersive x-ray spectroscopy (WDS), secondary ion mass spectrometry (SIMS) etc. Real time high resolution SEM imaging of the cutting and deposition process enables the researcher to perform very accurate three dimensional structural examinations and device modifications.

Paper Details

Date Published: 16 July 2002
PDF: 8 pages
Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473530
Show Author Affiliations
Peter Gnauck, LEO Elektronenmikroskopie GmbH (Germany)
Peter Hoffrogge, LEO Elektronenmikroskopie GmbH (Germany)
Jens Greiser, LEO Elektronenmikroskopie GmbH (Germany)

Published in SPIE Proceedings Vol. 4689:
Metrology, Inspection, and Process Control for Microlithography XVI
Daniel J. C. Herr, Editor(s)

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