Proceedings Paper
Implementing fully automatic macro defect detection and classification system in high-production semiconductor fab| Format | Member Price | Non-Member Price |
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Paper Abstract
The process of shifting from human after develop inspection (ADI) to automatic detection, classification and review of macro defects in the photolithography process is overviewed. The experiences and improvements from integration of automated macro defect detection and classification systems in a full volume, state-of-the-art production fab is described.
Paper Details
Date Published: 16 July 2002
PDF: 7 pages
Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473524
Published in SPIE Proceedings Vol. 4689:
Metrology, Inspection, and Process Control for Microlithography XVI
Daniel J. C. Herr, Editor(s)
PDF: 7 pages
Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473524
Show Author Affiliations
Lloyd Lee, Tokyo Electron America, Inc. (United States)
Michael Pham, Tokyo Electron America, Inc. (United States)
David Pham, ISOA Inc. (United States)
Michael Pham, Tokyo Electron America, Inc. (United States)
David Pham, ISOA Inc. (United States)
Manyam Khaja, ISOA Inc. (United States)
Kathleen A. Hennessey, ISOA Inc. (United States)
Juanita Miller, Texas Instruments Inc. (United States)
Kathleen A. Hennessey, ISOA Inc. (United States)
Juanita Miller, Texas Instruments Inc. (United States)
Published in SPIE Proceedings Vol. 4689:
Metrology, Inspection, and Process Control for Microlithography XVI
Daniel J. C. Herr, Editor(s)
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