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Proceedings Paper

Spectral scatterometry for 2D trench metrology of low-K dual-damascene interconnect
Author(s): Vladimir A. Ukraintsev; Mak Kulkarni; Christopher C. Baum; Karen Kirmse; Marco Guevremont; Suresh Lakkapragada; Kamal N. Bhatia; Pedro P. Herrera; Umar K. Whitney
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Paper Abstract

A systematic study has been conducted to evaluate accuracy and precision of spectral scatterometry used for two-dimensional (2D) characterization of trenches formed in fluorinated silicon glass (FSG). Experiments were done on short-flow dual-damascene Cu interconnect material. Trench critical dimensions (CD) obtained using KLA-Tencor's spectral scatterometer were correlated with data collected using CD atomic force microscope (AFM), CD scanning electron microscope (SEM) and transmission electron microscope (TEM). 3 major trench characteristics were analyzed: trench width, trench depth and sidewall angle. Spectral scatterometry demonstrated an excellent correlation (above 0.96) with CD AFM and SEM in tested trench width range of (80-240) nm and trench depth range of (410-450) nm. Spectral scatterometry showed acceptable correlation of 0.55 and minimal offset of 0.05 degrees with AFM in tested sidewall angle range of (87.5-89) degrees. Spectral scatterometry has demonstrated better than 1.0 nm and 0.2 degrees dynamic precision (3s) for both width and height and sidewall angle, respectively. We conclude that KLA-Tencor's SpectraCD system is capable of accurate and precise 2D characterization of FSG trenches. We recommend scatterometry as a high throughput and non-destructive metrology for trench linewidth and depth monitoring in low-K dielectric interconnect manufacturing.

Paper Details

Date Published: 16 July 2002
PDF: 7 pages
Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473457
Show Author Affiliations
Vladimir A. Ukraintsev, Texas Instruments Inc. (United States)
Mak Kulkarni, Texas Instruments Inc. (United States)
Christopher C. Baum, Texas Instruments Inc. (United States)
Karen Kirmse, Texas Instruments Inc. (United States)
Marco Guevremont, KLA-Tencor Corp. (United States)
Suresh Lakkapragada, KLA-Tencor Corp. (United States)
Kamal N. Bhatia, KLA-Tencor Corp. (United States)
Pedro P. Herrera, KLA-Tencor Corp. (United States)
Umar K. Whitney, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 4689:
Metrology, Inspection, and Process Control for Microlithography XVI
Daniel J. C. Herr, Editor(s)

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