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Proceedings Paper

Thermal expansion behavior of proposed EUVL substrate materials
Author(s): Ina Mitra; Mark J. Davis; Jochen Alkemper; Rolf Mueller; Heiko Kohlmann; Lutz Aschke; Ewald Moersen; Simone Ritter; Hrabanus Hack; Wolfgang Pannhorst
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Paper Abstract

The enhanced demands for substrate materials for next- generation optics and masks have initiated detailed investigations on Zerodur as a proposed EUVL substrate material. The dependence of thermal expansion of Zerodur on process parameters is illustrated herein as well as its utility for EUV substrate material demands. As a result of specifically adjusted process parameters, the coefficient of thermal expansion (CTE) was tailored to be a minimum at 22.5 degrees C. Laboratory samples of Zerodur exhibit a CTE corresponding to the lowest expansion class of the SEMI standard P37. By further variation of process parameters, the position of zero crossing, e.g. at 30 degrees C, can be varied, revealing an attractive attribute feature of Zerodur. A series of CTE measurements with a small block of Zerodur provides information on CTE homogeneity on a cm- scale: No CTE variation was observed within the error of measurements for a block exhibiting +/- 2 * 10-6 variation in refractive index. A new dilatometer type is in the course of development. First operational results are expected in Summer 2002 with an increased accuracy < ppb/K in the temperature range of 17 to 30 degrees C.

Paper Details

Date Published: 1 July 2002
PDF: 7 pages
Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472322
Show Author Affiliations
Ina Mitra, Schott Glas (Germany)
Mark J. Davis, Schott Glass Technologies (United States)
Jochen Alkemper, Schott Glas (Germany)
Rolf Mueller, Schott Glas (Germany)
Heiko Kohlmann, Schott Glas (Germany)
Lutz Aschke, Schott Lithotec AG (Germany)
Ewald Moersen, Schott Lithotec AG (Germany)
Simone Ritter, Schott Glas (Germany)
Hrabanus Hack, Schott Glas (Germany)
Wolfgang Pannhorst, Schott Glas (Germany)

Published in SPIE Proceedings Vol. 4688:
Emerging Lithographic Technologies VI
Roxann L. Engelstad, Editor(s)

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