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Proceedings Paper

Low-temperature wafer-scale warm embossing for mix and match with UV lithography
Author(s): Hubert Schulz; Matthias Wissen; Nils Roos; Hella-Christin Scheer; Karl Pfeiffer; Gabi Gruetzner
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Paper Abstract

The combination of nanoimprint and UV-lithography has been demonstrated. For this purpose a UV-sensitive epoxy based resin with a low glass temperature was prepared by adding low molecular weight components, in particular by increasing the monomer content. The suitability of our approach to minimize process temperatures was tested by embossing and VU-lithography. Mix and match of both techniques was used to demonstrate that the embossing step did not degrade the UV sensitivity of the material. UV processing provided in addition a simple means for stabilization of this low Tg material. Resists like mr-L 6000-1 xp may close the gap between 'hot embossing' 'UV-molding' and UV-lithography.

Paper Details

Date Published: 1 July 2002
PDF: 9 pages
Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472295
Show Author Affiliations
Hubert Schulz, Univ. of Wuppertal (Germany)
Matthias Wissen, Univ. of Wuppertal (Germany)
Nils Roos, Univ. of Wuppertal (Germany)
Hella-Christin Scheer, Univ. of Wuppertal (Germany)
Karl Pfeiffer, Micro Resist Technology GmbH (Germany)
Gabi Gruetzner, Micro Resist Technology GmbH (Germany)

Published in SPIE Proceedings Vol. 4688:
Emerging Lithographic Technologies VI
Roxann L. Engelstad, Editor(s)

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