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Proceedings Paper

Cost of ownership analysis for patterning using step and flash imprint lithography
Author(s): S. V. Sreenivasan; C. Grant Willson; Norman E. Schumaker; Douglas J. Resnick
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Paper Abstract

While the critical dimension in the microelectronics industry is continually going down due to developments in photolithography, it is coming at the expense of exponential increase in lithography tool costs and rising photomask costs. Step and Flash Imprint Lithography (S-FIL) is a nano-patterning technique that results in significantly lower cost of the lithography tool and process consumables. In this study, a comparison of S-FIL with Extreme Ultraviolet (EUV) photolithography technique is provided at the 50nm node. Advantages and disadvantages of S-FIL for various application sectors are provided. Finally, cost of ownership (CoO) computations of S-FIL versus EUV is provided. CoO computations indicate that S-FIL may be the cost-effective technology in the sub-100nm domain, particularly for emerging devices that are required in low volumes.

Paper Details

Date Published: 1 July 2002
PDF: 7 pages
Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472275
Show Author Affiliations
S. V. Sreenivasan, Univ. of Texas at Austin (United States)
C. Grant Willson, Univ. of Texas at Austin (United States)
Norman E. Schumaker, Molecular Imprints, Inc. (United States)
Douglas J. Resnick, Motorola (United States)

Published in SPIE Proceedings Vol. 4688:
Emerging Lithographic Technologies VI
Roxann L. Engelstad, Editor(s)

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