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Proceedings Paper

Water-jet guided laser: possibilities and potential for singulation of electronic packages
Author(s): Frank Ruediger Wagner; Akos Spiegel; Nandor Vago; Bernold Richerzhagen
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Paper Abstract

Singulation of packages is an important step in the manufacturing of IC devices. Presently, the most widely used technique is abrasive sawing. Due to the combination of different materials used in packages such as copper and mold compound, the saw rapidly blunts and also conventional laser cutting by a water-jet with the high precision and speed of a laser cut and is now applied into electronic package singulation.

Paper Details

Date Published: 18 June 2002
PDF: 8 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470656
Show Author Affiliations
Frank Ruediger Wagner, Synova Inc. (Switzerland)
Akos Spiegel, Budapest Univ. of Technology and Economics (Hungary)
Nandor Vago, Budapest Univ. of Technology and Economics (Hungary)
Bernold Richerzhagen, Synova Inc. (Switzerland)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund Jr.; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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