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Proceedings Paper

Laser-material processing: an industrial view of packaging applications
Author(s): James H. Brannon
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Paper Abstract

In the past two decades, laser applications in the packaging of microelectronics and photonics have clearly made a mark in industrial processing. With the commercial availability of reliable UV and IR lasers, a wealth of techniques and methods have evolved: generation of vias, high resolution patterning of materials by etching and ablation, laser bonding and micro welding, stripping of insulation and cladding, deposition of conductors, creation of surface microstructures, cleaning of sensitive surfaces, and a variety of drilling, slicing, and dicing processes. The list goes on and on, and what new techniques may evolve is limited only by human ingenuity. In this presentation we will review several of these applications with particular emphasis on those that are industrially useful. Many interesting concepts in laser processing fill the pages of scientific and engineering journals, but few of these ideas are seriously considered for a manufacturing environment. In conclusion, we will attempt to answer just what makes an industrially successful laser process.

Paper Details

Date Published: 18 June 2002
PDF: 5 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470654
Show Author Affiliations
James H. Brannon, IBM Storage Technology Div. (United States)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund Jr.; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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