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Proceedings Paper

Short-pulse-width micromachining of hard materials using DPSS Nd:YAG lasers
Author(s): Michael Heglin; Sergei V. Govorkov; Michael J. Scaggs; Haris Theoharidis; T. Schoelzel
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Paper Abstract

The material processing of an industrial, short-pulse duration DPPS YAG laser producing peak powers greater than 0.2MW is discussed in this paper. This peak power provides sufficient materials processing capability to meet the micro machining needs in the automotive, semiconductor, micro- electronic, medical and telecommunication industries. All hard and soft materials including: plastics, metals, ceramics, diamond and other crystalline materials are suitable candidates for the processing capability of this laser. Micro level features can be machined in these materials to a depth in excess of 1mm with high quality results. In most applications feature sizes can be achieved that are not possible or economical with existing technologies. The optical beam delivery system requirements, and overall micro-machining set-up are also described. The drilling and cutting versatility down to feature sizes of less than 7 micrometers , as well as, complex shapes are shown. The wavelength, pulse length, and peakpower are described and relate to their effect on recast, micro-cracking and material removal rates. Material removal effects related to progressive penetration into the material will be reviewed. The requirements of this DPSS laser technology to meet the operational requirements for high duty cycle operation in industrial environments is covered along with processing flexibility and lower operating cost.

Paper Details

Date Published: 18 June 2002
PDF: 11 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470646
Show Author Affiliations
Michael Heglin, Lambda Physik (United States)
Sergei V. Govorkov, Lambda Physik (United States)
Michael J. Scaggs, Lambda Physik (United States)
Haris Theoharidis, Lambda Physik (United States)
T. Schoelzel, Lambda Physik (United States)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund Jr.; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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