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Proceedings Paper

Laser-based sample preparation for electronic package failure analysis
Author(s): Brandon M. Frazier; Scott A. Mathews; Michael T. Duignan; Lars D. Skoglund; Zhiyong Wang; Rajen C. Dias
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Paper Abstract

Failure analysis has come to play a key role in ensuring quality and reliability in semiconductor devices, associated packaging and printed wiring boards. Tools are increasingly available to those investigating high-density integrated circuits at the die level, particularly for edit and repair operations. Until recently however, this capability has been limited by the inherent low-resolution mechanical/manual processes used for destructive analysis on electronics packaging. A laser-based tool has been developed to selectively and locally enable access to traces and layers within packages and provide a way to perform edits to an area of interest.

Paper Details

Date Published: 18 June 2002
PDF: 4 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470645
Show Author Affiliations
Brandon M. Frazier, Potomac Photonics, Inc. (United States)
Scott A. Mathews, Potomac Photonics, Inc. (United States)
Michael T. Duignan, Potomac Photonics, Inc. (United States)
Lars D. Skoglund, Intel Corp. (United States)
Zhiyong Wang, Intel Corp. (United States)
Rajen C. Dias, Intel Corp. (United States)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund Jr.; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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