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Proceedings Paper

Femtosecond laser machining of fluidic microchannels for miniaturized bioanalytical systems
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Paper Abstract

Femtosecond laser ablation of borosilicate glass has been studied to machine fluidic micro-channel geometries not possible through traditional micro-lithographic techniques. Utilizing a 1 kHz repetition rate femtosecond laser system and a long-working distance 5x objective lens, groove patterns 10 micrometers wide and as deep as 30 micrometers have been produced. The experiments were performed in air and the samples were cleaned after the ablation with sodium hydroxide dissolved in water to remove the debris. The substrates were mounted on a computer controlled x-y translation stage. The quality of the micro-channels showed dependency on the scanning speed of the sample. The surrounding area of the channels was smooth at scanning rates greater than 400 micrometers /s and smaller than 10 micrometers /s. Whereas, cracks appeared around the channels at scanning rates between 200 to 50 micrometers /s. Surface morphology is studied using optical, electron and atomic force microscopies. For a quantitative evaluation of ablation threshold and ablation rates, single-shot experiments in vacuum were performed. We found that the damage threshold for borosilicate glass is around 1.7 J/cm2. With single pulse laser fluence of 30 J/cm2, a 600 nm deep crater could be ablated. A ring, high than the surface, appeared around the craters and was most probably created by adiabatic compression of glass due to the high-pressure plasma generated in the early stages of the process.

Paper Details

Date Published: 18 June 2002
PDF: 6 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470625
Show Author Affiliations
Adela Ben-Yakar, Stanford Univ. (United States)
Robert L. Byer, Stanford Univ. (United States)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund Jr.; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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