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Proceedings Paper

Optical assembly of collimator arrays for MEMS applications
Author(s): Nina Zhang; Frank Vodhanel; Martin Hagenbuechle
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Paper Abstract

In the collimator array development effort for MEMS applications, the ability to align devices automatically that meets industry target specifications of power throughput for multiple channels has been demonstrated. Results show eight-channel devices have been successfully aligned and attached within 2-dB power loss. Three key factors of success include: (1) Automated Pitch/Yaw using virtual pivot, (2) initial mirror alignment to verify parallelism between fiber array and lens array, (3) channel balance algorithm to compensate for lens array pitch and focal length variations.

Paper Details

Date Published: 3 June 2002
PDF: 6 pages
Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469566
Show Author Affiliations
Nina Zhang, Newport Corp. (United States)
Frank Vodhanel, Newport Corp. (United States)
Martin Hagenbuechle, Newport Corp. (United States)

Published in SPIE Proceedings Vol. 4652:
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Louay A. Eldada; John R. Rowlette Sr.; Randy A. Heyler; Randy A. Heyler; John R. Rowlette Sr., Editor(s)

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